Customization: | Available |
---|---|
Feature: | Good Mechanical Strength, Good Thermal Insulation Performance, High-Temperature Resistant, Light Weight, Low Thermal Conductivity |
Refractoriness (℃): | 1580< Refractoriness< 1770 |
Still deciding? Get samples of US$ 5500/Ton
Request Sample
|
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Nano heat insulation board use lightweight, inorganic silica and ceramic fibers with low thermal conductivity are used as raw materials, and aluminum foilwith high reflectivity is used as the underlying material. The single-layer composite structure is formed by continuous coatingand composite pressing process, and its thermal conductivity is higher than that of static The air is smaller, and the thermalinsulation performance is about 3 to 5 times better than that of traditional thermal insulation materials. t is the best thermalinsulation material so far.
Features Of Nano Insulation Board
Applications Of Nano Insulation Board
Physical And Chemical Indicators Of Nano Insulation Board
Product Name |
Nano heat shield |
Inspection Standard |
|
Product code |
JSGW-950/1050/1100 |
||
Melting point |
≥1200ºC |
||
Usage temperature |
950ºC-1100ºC |
||
Density (±10%) |
320kg/m3 | GB/T17911-2006 | |
Specific heat capacity(400ºC) |
0.8kJ/kg.k | YB/T4130-2005 | |
Compressive strength ( compression 10 % ) |
0.3MPa | GB/T 13480-1992 | |
Linear Shrinkage(800ºC) |
2.0% | GB/T17U911-2006 | |
Thermal conductivity(w/m.k) |
70ºC |
0.019 | YB/T4130-2005 |
200ºC |
0.021 | ||
400ºC |
0.024 | ||
600ºC |
0.031 | ||
800ºC |
0.040 |